MG游戏有限公司最新推出无铅中温Sn/Bi/Cu合金锡膏，型号：中温锡膏PF-3005-C，具特性如下：

1. 熔点低（146～190℃），焊接温度接近锡铅锡膏，对元器件和板材耐热性要求低，生产工艺窗口大；

2. 相对于目前常用的无铅合金锡膏（如Sn/Ag/Cu或Sn/Bi/Ag），成本低；

3. 热导性好，在散热模组产品上应用此产品，其热导率比Sn/Bi合金增高一倍左右；

4. 此合金机械强度接近Sn/Ag/Cu合金。

4. 此产品采用球形度好、颗粒度分布均匀的锡粉炼制而成，粘度适中，适应各种涂布方法；

5. 印刷滚动性、脱膜性及抗坍塌性均表现优良，可有效解决密间距和小元件的焊盘印刷；

6. 润湿性好，能适应不同的金属镀层；焊后板面残留极少且透明、阻抗高，焊点平滑饱满；

7. 此款合金锡膏可作为Sn/Ag/Cu合金（表面贴装和通孔涂布工艺）及Sn/Bi（散热模组）类型产品的替代品；可有效地缓解焊料行业中对Ag需求的剧烈增加和避免无铅的高温焊接；解决了Sn/Bi焊料在散热模组产品上的低热导问题。

        Legret metal Co., Ltd. launches the middle temperature Lead-free solder paste Sn/Bi/Cu newly. Its characteristics are as follows:

1. Lower melting point, weld temperature is close to the Sn/Pb solder paste.Lower heat-resistant requirements of the components and panels, the production technology window are larger;

2. Lower cost to the common Lead-free solder paste that currently used (such as Sn/Ag/Cu or Sn/Bi/Ag);

3. Good thermal conductivity, using this product on the products of mould group of heatsink, its heat conduction rate increases by about one time than Sn/Bi alloy;It shows good thermal conductivity. Its heat conduction rate increases by about one time of the Sn/Bi alloy's when used on the mould group of heatsink. 

4. The mechanical intensity of this alloy is close to Sn/Ag/Cu.

附本锡膏应用案例：

1、应用于散热器的焊接

2、应用于表面贴装